Specification
Model ID |
NPM-W2 |
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Rear head |
Lightweight |
12-nozzle head |
Lightweight |
3-nozzle head V2 |
Dispensing head |
No head |
Lightweight 16-nozzle head |
NM-EJM7D |
NM-EJM7D-MD |
NM-EJM7D |
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12-nozzle head |
NM-EJM7D-MD |
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Lightweight 8-nozzle head | ||||||
3-nozzle head V2 | ||||||
Dispensing head |
NM-EJM7D-MD |
NM-EJM7D-D |
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Inspection head |
NM-EJM7D-MA |
NM-EJM7D-A |
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No head |
NM-EJM7D |
NM-EJM7D-D |
PCB dimensions |
Single-lane*1 |
Batch mounting |
L 50 x W 50 ~ L 750 x W 550 |
2-positin mounting |
L 50 x W 50 ~ L 350 x W 550 |
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Dual-lane*1 |
Dual transfer (Batch) |
L 50 × W 50 ~ L 750 × W 260 |
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Dual transfer (2-positin) |
L 50 × W 50 ~ L 350 × W 260 |
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Single transfer (Batch) |
L 50 × W 50 ~ L 750 × W 510 |
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Single transfer (2-positin) |
L 50 × W 50 ~ L 350 × W 510 |
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Electric source |
3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA |
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Pneumatic source *2 |
0.5 MPa, 200 L /min (A.N.R.) |
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Dimensions *2 (mm) |
W 1 280*3 × D 2 332 *4 × H 1 444 *5 |
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Mass |
2 470 kg (Only for main body : This differs depending on the option configuration.) |
Placement head |
Lightweight 16-nozzle head(Per head) |
12-nozzle head |
Lightweight 8-nozzle head |
3-nozzle head V2 |
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High production mode[ON] |
High production mode[OFF] |
High production mode[ON] |
High production mode[OFF] |
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Max. peed |
38 500cph |
35 000cph |
32 250cph |
31 250cph |
20 800cph |
8 320cph |
|
Placement accuracy |
±40 μm / chip |
±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip |
±30 μm / chip |
± 30 µm/chip |
± 30 µm/QFP |
|
Component |
0402*7 chip ~ L 6 x W 6 x T 3 |
03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 |
0402*7 chip ~ L 12 x W 12 x T 6.5 |
0402*7 chip ~ L 32 x W 32 x T 12 |
0603 chip to L 150 x W 25 (diagonal152) x T 30 |
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Component |
Taping |
Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm |
Tape : 4 to 56 mm |
ape : 4 to 56 / 72 / 88 / 104 mm |
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Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 |
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Stick |
Front/rear feeder cart specifications : |
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Tray |
Single tray specifications : Max.20 |
Dispensing head |
Dot dispensing |
Draw dispensing |
Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation |
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
Adhesive position accuracy (Cpk□1) |
± 75 μ m /dot |
± 100 μ m /component |
Applicable components |
1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP |
BGA, CSP |
Inspection head |
2D inspection head (A) |
2D inspection head (B) |
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Resolution |
18 µm |
9 µm |
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View size (mm) |
44.4 x 37.2 |
21.1 x 17.6 |
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Inspection processing time |
Solder Inspection *10 |
0.35s/ View size |
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Component Inspection *10 |
0.5s/ View size |
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Inspection object |
Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) |
Chip component : 80 μm × 120 μm or more (0402 or more) |
Component Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
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Inspection items |
Solder Inspection *10 |
Oozing, blur, misalignment, abnormal shape, bridging |
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Component Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 |
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Inspection position accuracy *13( Cpk□1) |
± 20 μm |
± 10 μm |
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No. of inspection |
Solder Inspection *10 |
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) |
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Component Inspection *10 |
Max. 10 000 pcs./machine |
*1 |
: |
Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. |
*2 |
: |
Only for main body |
*3 |
: |
1 880 mm in width if extension conveyors (300 mm) are placed on both sides. |
*4 |
: |
Dimension D including tray feeder : 2 570 mm |
*5 |
: |
Excluding the monitor, signal tower and ceiling fan cover. |
*6 |
: |
±25 μm placement support option.(Under conditions specified by PSFS) |
*7 |
: |
The 03015/0402 chip requires a specific nozzle/feeder. |
*8 |
: |
Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip) |
*9 |
: |
A PCB height measurement time of 0.5s is included. |
*10 |
: |
One head cannot handle solder inspection and component inspection at the same time. |
*11 |
: |
Please refer to the specification booklet for details. |
*12 |
: |
Foreign object is available to chip components.(Excluding 03015 mm chip) |
*13 |
: |
This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions.
*Please refer to the specification booklet for details.
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